pb lead-free parts round type led lamps ligitek electronics co.,ltd. property of ligitek only data sheet LUR3130-PF LUR3130-PF - 2007 a doc. no : qw0905- rev. : date : 10 - oct.
1/5 page 4.75 ligitek electronics co.,ltd. property of ligitek only 0.5 typ + - 2.54typ 1.0min 25.0min 7.65 30 0 60 50%50% 25% 0 25%100% 75% LUR3130-PF part no. directivity radiation -60 100%75% package dimensions note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. -30 1.5max
2/5 page ligitek electronics co.,ltd. property of ligitek only luminous intensity @20ma(mcd) viewing angle 2 # 1/2 (deg) 46 350 550 typ. min. 20 spectral halfwidth $% nm peak wave length % pnm 2.4 1.5 20 660 lensmin. part nomaterial red gaalas LUR3130-PF emitted note : 1.the forward voltage data did not including " 0.1v testing tolerance. 2. the luminous intensity data did not including " 15% testing tolerance. red diffused color forward voltage @ ma(v) max. typical electrical & optical characteristics (ta=25 & ) absolute maximum ratings at ta=25 & LUR3130-PF part no. * operating temperature storage temperature -40 ~ +80 -40 ~ +100 tstg t opr & & forward current electrostatic discharge( * ) reverse current @5v peak forward current duty 1/10@10khz power dissipation parameter ma 40 i f 10 2000 esd ir v ' a 120 120 i fp pd ma mw ur ratings symbol unit static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded.
ligitek electronics co.,ltd. property of ligitek only 0.0 0.8 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 wavelength (nm) ambient temperature( ) fig.5 relative intensity vs. wavelength r e l a t i v e i n t e n s i t y @ 2 0 m a 1.0 0.0 600 0.5 -40-20 650700750 -40 80 20 04060100 ambient temperature( ) -20040 20100 80 60 1 f o r w a r d c u r r e n t ( m a ) r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.3 forward voltage vs. temperature 0.9 1.0 1.1 1.2 0 1 1.0 1.0 0.5 1.5 2.0 2.5 3.0 1 fig.4 relative intensity vs. temperature forward voltage(v) 3.0 2.04.0 0.0 5.0 0.5 forward current(ma) 100 101000 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 10 100 1000 ur chip fig.2 relative intensity vs. forward current 2.5 1.5 1.0 2.0 3.0 page3/4 part no. LUR3130-PF
page 4/5 soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only temp( c) 260 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 150 100 time(sec) 2 /sec max 120 preheat 0 60 seconds max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 5 /sec max 2.wave soldering profile part no. LUR3130-PF
page 5/5 reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 reliability test: description 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) operating life test high temperature storage test test item this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. ligitek electronics co.,ltd. property of ligitek only jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs thermal shock test high temperature high humidity test low temperature storage test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec solderability test solder resistance test the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. part no. LUR3130-PF
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